| OD08 | Package Size:12.8*12.8*5.5;Frequency:32.768KHz~220MHz;Supply Voltage:1.8V~5V;Frequency stability:±5ppm~±50ppm;Output Leve:HCMOS/TTL;working temperature:-55℃~+125℃; | |
| OD14 | Package Size:20.2*12.8*5.08;Frequency:32.768KHz~220MHz;Supply Voltage:1.8V~5V;Frequency stability:±5ppm~±50ppm;Output Leve:HCMOS/TTL;working temperature:-55℃~+125℃; | |
| OF22 | Package Size:2.5*2.0*0.8;Frequency:32.768KHz~220MHz;Supply Voltage:1.8V~5V;Frequency stability:±5ppm~±50ppm;Output Leve:HCMOS/TTL;working temperature:-55℃~+125℃; | |
| OF32 | Package Size:3.2×2.5×1.1;Frequency:32.768KHz~400MHz;Supply Voltage:1.8V~5V;Frequency stability:±25 ~ ±50;Output Leve:HCMOS/TTL;working temperature:-55℃~+125℃; | |
| OS32 | Package Size:3.2×2.5×1.0;Frequency:10MHz~1500MHz;Supply Voltage:1.8V~5V;Frequency stability:±15ppm,±25ppm,±50ppm,±100ppm;Output Leve:LVPECL、LVDS、HCSL;working temperature:-55℃~+125℃; | |
| OF53 | Package Size:5.0×3.2×1.2;Frequency:32.768KHz~220MHz;Supply Voltage:1.8V~5V;Frequency stability:±5ppm~±50ppm;Output Leve:HCMOS/TTL;working temperature:-55℃~+125℃; | |
| OS53 | Package Size:5.0*3.2*1.25;Frequency:10MHz~1500MHz;Supply Voltage:2.5V、3.3V;Frequency stability:±5ppm~±50ppm;Output Leve:LVPECL、LVDS;working temperature:-55℃~+125℃; | |
| OF75 | Package Size:7.0*5.0*1.3;Frequency:32.768KHz~220MHz;Supply Voltage:1.8V~5V;Frequency stability:±5ppm~±50ppm;Output Leve:HCMOS/TTL;working temperature:-55℃~+125℃; | |
| OS75 | Package Size:7.5*5.0*1.6;Frequency:10MHz~1500MHz;Supply Voltage:2.5V、3.3V;Frequency stability:±5ppm~±50ppm;Output Leve:LVPECL、LVDS;working temperature:-55℃~+125℃; | |
| OE75 | Package Size:7.0*5.0*1.8;Frequency:32.768KHz~220MHz;Supply Voltage:1.8V~5V;Frequency stability:±15ppm,±25ppm,±50ppm,±100ppm;Output Leve:LVPECL、LVDS、HCSL、CML;working temperature:-55℃~+125℃; | |